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Tailored Design of Suppressor Additives for Copper Plating by Combining Functionalities

Type of publication Peer-reviewed
Publikationsform Original article (peer-reviewed)
Publication date 2013
Author Hai Nguyen T. M., Janser Félice, Luedi Nicola, Broekmann Peter,
Project New concepts for the 3D-TSV electroplating: From the tailored design to the application of suppressor additives
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Original article (peer-reviewed)

Journal ECS Electrochemistry Letters
Volume (Issue) 2(11)
Page(s) 52 - 54
Title of proceedings ECS Electrochemistry Letters
DOI 10.1149/2.005311eel


An extraordinarily strong suppressor additive (IPEG) for copper plating has been synthesized by the copolymerization of imidazole and poly(ethylene glycol) diglycidyl ether (PEG-DGE). This new IPEG polymer contains the typical functional groups of both PAG (poly(alkylene glycol)) and IMEP (polymerizate of imidazole and epichlorohydrin) polymers. The new IPEG polymer combines the properties of PAG (typical suppressor for Damascene applications) and IMEP (state-of-the-art leveler for Damascene applications). The combination of two suppressing modes of action in a single polymer results in significant enhancement of the suppressing capacity of this new IPEG polymer over that of conventional suppressors and levelers.