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On the role of halides and thiols in additive-assisted copper electroplating

Type of publication Peer-reviewed
Publikationsform Original article (peer-reviewed)
Publication date 2013
Author Huynh Thi M. T., Weiss Florian, Hai Nguyen T. M., Reckien Werner, Bredow Thomas, Fluegel Alexander, Arnold Marco, Mayer Dieter, Keller Hubert, Broekmann Peter,
Project New concepts for the 3D-TSV electroplating: From the tailored design to the application of suppressor additives
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Original article (peer-reviewed)

Journal ELECTROCHIMICA ACTA
Volume (Issue) 89
Page(s) 537 - 548
Title of proceedings ELECTROCHIMICA ACTA

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