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Potential Oscillations in Galvanostatic Cu Electrodeposition: Antagonistic and Synergistic Effects among SPS, Chloride, and Suppressor Additives

Type of publication Peer-reviewed
Publikationsform Original article (peer-reviewed)
Publication date 2012
Author Hai NTM, Oderrnatt J, Grimaudo V, Kramer KW, Fluegel A, Arnold M, Mayer D, Broekmann P,
Project New concepts for the 3D-TSV electroplating: From the tailored design to the application of suppressor additives
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Original article (peer-reviewed)

Journal JOURNAL OF PHYSICAL CHEMISTRY C
Volume (Issue) 116(12)
Page(s) 6913 - 6924
Title of proceedings JOURNAL OF PHYSICAL CHEMISTRY C

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