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Competitive anion/anion interactions on copper surfaces relevant for Damascene electroplating

Type of publication Peer-reviewed
Publikationsform Original article (peer-reviewed)
Author Hai NTM, Huynh TTM, Fluegel A, Arnold M, Mayer D, Reckien W, Bredow T, Broekmann P,
Project Copper/Electrolyte Interfaces under Reactive Conditions
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Original article (peer-reviewed)

Journal ELECTROCHIMICA ACTA
Volume (Issue) 70
Page(s) 286 - 295
Title of proceedings ELECTROCHIMICA ACTA

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