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On the role of halides and thiols in additive-assisted copper electroplating

Type of publication Peer-reviewed
Publikationsform Original article (peer-reviewed)
Author Huynh Thi M. T., Weiss Florian, Hai Nguyen T. M., Reckien Werner, Bredow Thomas, Fluegel Alexander, Arnold Marco, Mayer Dieter, Keller Hubert, Broekmann Peter,
Project Copper/Electrolyte Interfaces under Reactive Conditions
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Original article (peer-reviewed)

Journal ELECTROCHIMICA ACTA
Volume (Issue) 89
Page(s) 537 - 548
Title of proceedings ELECTROCHIMICA ACTA
DOI 10.1016/j.electacta.2012.10.152

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