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Projects as responsible applicant

Responsible applicant Institution of higher education Start End date Funding scheme

New concepts for the 3D-TSV electroplating: From the tailored design to the application of suppressor additives
Nguyen Thi Minh Hai University of Berne - BE 01.02.2012 31.01.2014 Marie Heim-Voegtlin grants

New concepts for the 3D-TSV electroplating: From the tailored design to the application of suppressor additives
Nguyen Thi Minh Hai University of Berne - BE 01.02.2014 31.03.2015 Marie Heim-Voegtlin grants

Projects as member of staff

Responsible applicant Institution of higher education Start End date Funding scheme

Copper/Electrolyte Interfaces under Reactive Conditions
Broekmann Peter University of Berne - BE 01.09.2010 31.08.2013 Project funding

New concepts for the 3D-TSV electroplating: From the tailored design to the application of suppressor additives
Nguyen Thi Minh Hai University of Berne - BE 01.02.2014 31.03.2015 Marie Heim-Voegtlin grants

New concepts for the 3D-TSV electroplating: From the tailored design to the application of suppressor additives
Nguyen Thi Minh Hai University of Berne - BE 01.02.2012 31.01.2014 Marie Heim-Voegtlin grants

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