Copper electroplating; 3D-TSV; Leveler; Suppressor additive; Copper interconnect; Copper technology; Suppressor polymer; Electrochemistry; Polymer synthesis
Huynh Thi M. T., Weiss Florian, Hai Nguyen T. M., Reckien Werner, Bredow Thomas, Fluegel Alexander, Arnold Marco, Mayer Dieter, Keller Hubert, Broekmann Peter (2013), On the role of halides and thiols in additive-assisted copper electroplating, in ELECTROCHIMICA ACTA
, 89, 537-548.
Hai N. T. M., Furrer J., Stricker F., Huynh T. M. T., Gjuroski I., Luedi N., Brunner T., Weiss F., Fluegel A., Arnold M., Chang I., Mayer D., Broekmann P. (2013), Polyvinylpyrrolidones (PVPs): Switchable Leveler Additives for Damascene Applications, in Journal of The Electrochemical Society
, 160(12), 3116-3125.
Huynh T. M. T., Hai N. T. M., Broekmann P. (2013), Quasi-Reversible Interaction of MPS and Chloride on Cu(100) Studied by In Situ STM, in Journal of The Electrochemical Society
, 160(12), 3063-3069.
Hai Nguyen T. M., Janser Félice, Luedi Nicola, Broekmann Peter (2013), Tailored Design of Suppressor Additives for Copper Plating by Combining Functionalities, in ECS Electrochemistry Letters
, 2(11), 52-54.
Hai NTM, Kramer KW, Fluegel A, Arnold M, Mayer D, Broekmann P (2012), Beyond interfacial anion/cation pairing: The role of Cu(I) coordination chemistry in additive-controlled copper plating, in ELECTROCHIMICA ACTA
, 83, 367-375.
Hai NTM, Huynh TTM, Fluegel A, Arnold M, Mayer D, Reckien W, Bredow T, Broekmann P (2012), Competitive anion/anion interactions on copper surfaces relevant for Damascene electroplating, in ELECTROCHIMICA ACTA
, 70, 286-295.
Keller H, Saracino M, Nguyen HMT, Thi MTH, Broekmann P (2012), Competitive Anion/Water and Cation/Water Interactions at Electrified Copper/Electrolyte Interfaces Probed by in Situ X-ray Diffraction, in JOURNAL OF PHYSICAL CHEMISTRY C
, 116(20), 11068-11076.
Hai N. T. M., Furrer J., Gjuroski I., Bircher M. P., Cascella M., Broekmann P. (2012), On the Acceleration of Cu Electrodeposition by TBPS (3,3-thiobis-1-propanesulfonic acid): A Combined Electrochemical, STM, NMR, ESI-MS and DFT Study, in Journal of The Electrochemical Society
, 160(12), 3158-3164.
Hai NTM, Oderrnatt J, Grimaudo V, Kramer KW, Fluegel A, Arnold M, Mayer D, Broekmann P (2012), Potential Oscillations in Galvanostatic Cu Electrodeposition: Antagonistic and Synergistic Effects among SPS, Chloride, and Suppressor Additives, in JOURNAL OF PHYSICAL CHEMISTRY C
, 116(12), 6913-6924.
Within the framework of this project it is intended to develop new concepts for the superfill of large, micrometer-sized copper interconnect architectures that are needed for the future 3D-TSV (Through Silicon Via) technology. This project involves the tailored design (synthesis) of new electroplating additives, mechanistic studies on the action mode of these new types of additives at the copper/electrolyte interface under reactive conditions and finally the ultimate proof-of-principle of these concepts using state-of-the-art 3D-TSV test structures. This project is therefore going to cover topics, approaches and methodologies from both fundamental and applied research.