flow boiling; microchannel two-phase cooling; thermosyphon cooling; microevaporator; igbt
CataldoFilippo (2018), Experimental Evaluation of a Passive Thermosyphon Cooling System for Power Electronics, World Scientific Publishing Company Pte Limited, USA, 279-319.
Cataldo Filippo (2018), Experimental evaluation of a passive thermosyphon cooling system using dfferent low-GWP refrigerants, World Scientific Publishing Company Pte Limited, USA, 329-367.
CataldoFilippo (2018), Experimental performance of a completely passive thermosyphon cooling system rejecting heat by natural convection using the working fluids r1234ze, r1234yf, and r134a, in Journal of Electronic Packaging
CataldoFilippo (2017), Experimental evaluation of the thermal performances of a thermosyphon cooling system rejecting heat by natural and forced convection, in Applied Thermal Engineering
This sub-project proposal is part of the "SwiSS Transformer" - Solid State SiC Transforms umbrella project. The new 3D SiC module proposed here with multiple chips sandwiched in between two-phase cooling elements (using microchannel flow boiling as the cooling process) is an innovative concept that will exploit the full potential of the semiconductor. The strategy to achieve this goal is to bring the coolant in close contact with the semiconductor. This allows a much more compact packaging of the module, i.e. a 3D stacking of the semiconductors. With this strategy, the coolant is introduced inside the package and is in close contact with the semiconductor. With this innovative approach, several thermal interfaces are eliminated between the dielectric cooling fluid (a refrigerant) and the semiconductor. We intend to develop a two-phase cooling solution here (possibly with passive thermosyphon flow circulation without a pump) using the latest low-cost production methods of such cooling structures. This method is very ambitious and has a very high thermal cooling performance potential for now and the future.