Electrochemistry; Metal deposition; Adsorption phenomena; Redoxchemistry; Copper technology; dual Damascene process; copper plating; electrified interfaces; scanning tunneling microscopy; X-ray scattering
Huynh Thi M. T., Weiss Florian, Hai Nguyen T. M., Reckien Werner, Bredow Thomas, Fluegel Alexander, Arnold Marco, Mayer Dieter, Keller Hubert, Broekmann Peter (2013), On the role of halides and thiols in additive-assisted copper electroplating, in ELECTROCHIMICA ACTA
, 89, 537-548.
Huynh Thi Mien Trung, Weiss Florian, Hai Nguyen T M, Reckien Werner, Bredow Thomas, Arnold Marco, Mayer Dieter, Keller Hubert J., Broekmann Peter (2013), On the role of halides and thiols in additive-assisted copper electroplating, in Electrochimica Acta
, 89, 537-548.
Hai Nguyen Thi Minh, Furrer Julien, Stricker F., Huynh Thi Mien Trung, Gjuroski I., Luedi N., Brunner T., Weiss Florian, Fluegel Alexander, Arnold Marco, Chang I., Mayer Dieter, Broekmann Peter (2013), Polyvinylpyrrolidones (PVPs): Switchable leveler additives for damascene applications, in Journal of the Electrochemical Society
, 160(12), D3116-D3125.
Hai Nguyen T. M., Kraemer Karl W., Fluegel Alexander, Arnold Marco, Mayer Dieter, Broekmann Peter (2012), Beyond interfacial anion/cation pairing: The role of Cu(I) coordination chemistry in additive-controlled copper plating, in ELECTROCHIMICA ACTA
, 83, 367-375.
Hai NTM, Huynh TTM, Fluegel A, Arnold M, Mayer D, Reckien W, Bredow T, Broekmann P (2012), Competitive anion/anion interactions on copper surfaces relevant for Damascene electroplating, in ELECTROCHIMICA ACTA
, 70, 286-295.
Hai N. T. M., Huynh T. T. M., Fluegel A., Arnold M., Mayer D., Reckien W., Bredow T., Broekmann P. (2012), Competitive anion/anion interactions on copper surfaces relevant for Damascene electroplating, in ELECTROCHIMICA ACTA
, 70, 286-295.
Keller Hubert, Saracino Martino, Nguyen Hai M. T., Broekmann Peter (2012), Competitive Anion/Water and Cation/Water Interactions at Electrified Copper/Electrolyte Interfaces Probed by in Situ X-ray Diffraction, in JOURNAL OF PHYSICAL CHEMISTRY C
, 116(20), 11068-11076.
Keller H, Saracino M, Nguyen HMT, Thi MTH, Broekmann P (2012), Competitive Anion/Water and Cation/Water Interactions at Electrified Copper/Electrolyte Interfaces Probed by in Situ X-ray Diffraction, in JOURNAL OF PHYSICAL CHEMISTRY C
, 116(20), 11068-11076.
Hai NTM, Oderrnatt J, Grimaudo V, Kramer KW, Fluegel A, Arnold M, Mayer D, Broekmann P (2012), Potential Oscillations in Galvanostatic Cu Electrodeposition: Antagonistic and Synergistic Effects among SPS, Chloride, and Suppressor Additives, in JOURNAL OF PHYSICAL CHEMISTRY C
, 116(12), 6913-6924.
Hai NTM, Huynh TMT, Fluegel A, Mayer D, Broekmann P (2011), Adsorption behavior of redox-active suppressor additives: Combined electrochemical and STM studies, in Electrochimica Acta
, 56(21), 7361-7370.
Broekmann P, Fluegel A, Emnet C, Arnold M, Roeger-Goepfert C, Wagner A, Hai NTM, Mayer D (2011), Classification of suppressor additives based on synergistic and antagonistic ensemble effects, in Electrochimica Acta
, 56(13), 4724-4734.
Simona F, Hai NTM, Broekmann P, Cascella M (2011), From Structure to Function: Characterization of Cu(I) Adducts in Leveler Additives by DFT Calculations, in JOURNAL OF PHYSICAL CHEMISTRY LETTERS
, 2(24), 3081-3084.
Copper electrodeposition is a key processing step in today`s chip manufacturing. The so-called Copper Dual Damascene Process allows the fast and defect-free on-chip metallization of vias and trenches in one single processing step. Interconnect feature sizes of the future 32nm and 22nm technology nodes reaches diameters below 50nm. With the shrinking feature dimensions into the lower nano-meter regime it becomes evident that the interfacial structure becomes increasingly important for the mastering of deposition processes in those spatially confined features. Essential for the working of the Damascene Process are various organic and inorganic additives. Ensembles of these additives form characteristic structural motifs at the interface that cause either an accelerating or a suppressing effect. It is the aim of this project to develop characteristic structural motifs on idealized model substrates that are capable to mimic the active additive ensembles in the real deposition process. This will allow us studying these structural motifs under well defined conditions in order to unravel the synergistic interplay of individual additives in these additive ensembles at the interface (ensemble effect: function through structure). Not only is the structure of these additive ensembles of interest but also their formation kinetics. Essentially new will be the focus on additive adsorption phenomena under reactive conditions where the additive adsorption can be superimposed on simultaneous electron-transfer reactions (when the adsorbent is redox-active) or an simultaneous ion-transfer reactions (metal deposition). These reactive conditions are supposed to have a major impact on the resulting active additive ensemble at the interface. We will apply modern structure-sensitive in-situ techniques such as scanning tunneling microscopy (STM) and X-ray diffraction (XRD) for the characterization of the additive action at the interface. The major challenge in this context is to improve the time-resolution in both experiments as a crucial pre-requisite to study these complex interfaces under reactive conditions. Fundamentally new for the electrochemical surface science will be in this context the implementation of new 2D X-ray detector technology into the in-situ diffraction experiment.