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Millimeter-wave system integration based on EBG-slab waveguide

Titel Englisch Millimeter-wave system integration based on EBG-slab waveguide
Gesuchsteller/in Hafner Christian
Nummer 126369
Förderungsinstrument Projektförderung (Abt. I-III)
Forschungseinrichtung Institut für elektromagnetische Felder ETH Zürich
Hochschule ETH Zürich - ETHZ
Hauptdisziplin Elektroingenieurwesen
Beginn/Ende 01.04.2010 - 31.03.2013
Bewilligter Betrag 301'828.00
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Alle Disziplinen (2)

Disziplin
Elektroingenieurwesen
Mikroelektronik, Optoelektronik

Keywords (4)

Electromagnetic band-gap (EBG); Millimeter-wave circuit; Millimeter-wave antenna; Terahertz

Lay Summary (Englisch)

Lead
Lay summary
There is increasing interest on millimeter-wave systems working at frequencies around and above 100 GHz. Such systems promise attractive communication applications featuring ultra-high data-rates, security applications using millimeter-wave vision, and sensing devices.The project will establish a comprehensive set of techniques to realize compact, high-performance, and cost-efficient systems for this envisaged frequency region. We will make use of low-loss, electromagnetic-bandgap (EBG) confined dielectric waveguide, we will introduce structures for low-loss coupling (by means of radiation, that is, without wirebonds) between active components and waveguides, and we will provide all sorts of passive components including antenna radiators in the EBG-enabled slab waveguide technology. The goal is to establish a set of techniques, which will create a new benchmark in terms of low power loss, low cost, and efficient consideration of thermal and weight aspects.The concept is based on modifications of a dielectric slab surface-wave waveguide. Periodic modifications of the dielectric slab (extending in two dimensions) will eventually create an electromagnetic bandgap (EBG) at a certain frequency band, thereby prohibiting the propagation of the surface-wave mode. By disturbing the periodic EBG structure, EBG waveguides and passive functionalities can be created, including bends, couplers, dividers, and antenna radiators. Practically realizable dielectric materials shall be considered, such as plastics or ceramic powder-filled plastics. Investigations will quantify accuracy requirements for the periodic modifications (which are likely to be produced mechanically, e.g., by punching) and for the material properties (considering, e.g., temperature effects).
Direktlink auf Lay Summary Letzte Aktualisierung: 21.02.2013

Verantw. Gesuchsteller/in und weitere Gesuchstellende

Mitarbeitende

Publikationen

Publikation
Propagation and excitation of the higher-order Ex11 mode in an insulated image guide
Dolatsha N, Hesselbarth J (2012), Propagation and excitation of the higher-order Ex11 mode in an insulated image guide, in MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, 54(1), 179-181.
Power divider based on grounded dielectric slab waveguide operating in Ex11 mode
Dolatsha Nemat (2011), Power divider based on grounded dielectric slab waveguide operating in Ex11 mode, in Hesselbarth Jan, Ieee explore, 6th German Microwave conference.
Low-Loss millimeter-wave propagation of the Ex11 mode in a synthesized insulated image guide
Dolatsha Nemat, Low-Loss millimeter-wave propagation of the Ex11 mode in a synthesized insulated image guide, in Hesselbarth Jan, IEEE International Microwave Conference 2012, Montreal, Montreal.
Millimeter-wave antenna array fed by an insulated image guide operating in higher-order Ex11 mode
Dolatsha N, Hesselbarth J, Millimeter-wave antenna array fed by an insulated image guide operating in higher-order Ex11 mode, in IEEE Transactions Antennas Propagation, 61(6), 1-6.
Millimeter-Wave chip-to-chip transmission using an insulated image guide excited by an on-chip dipole antenna at 90 GHz
Dolatsha Nemat, Hesselbarth Jan, Millimeter-Wave chip-to-chip transmission using an insulated image guide excited by an on-chip dipole antenna at 90 GHz, in IEEE Microwave & wireless Component Letter.

Zusammenarbeit

Gruppe / Person Land
Formen der Zusammenarbeit
Universität Stuttgart,Institut für Hochfrequenztechnik Deutschland (Europa)
- Publikation
Seminar of Applied Mathematics, ETH Schweiz (Europa)
- vertiefter/weiterführender Austausch von Ansätzen, Methoden oder Resultaten
- Austausch von Mitarbeitern
Stanford University Vereinigte Staaten von Amerika (Nordamerika)
- vertiefter/weiterführender Austausch von Ansätzen, Methoden oder Resultaten

Wissenschaftliche Veranstaltungen

Aktiver Beitrag

Titel Art des Beitrags Titel des Artikels oder Beitrages Datum Ort Beteiligte Personen
IEEE International Microwave Syposium, Montreal, June ,2012 Vortrag im Rahmen einer Tagung Low-Loss Millimeter-Wave Propagation of the 11 Ex Mode in a Synthesized Insulated Image Guide 18.06.2012 Montreal, Canada, Kanada Hesselbarth Jan; Dolatsha Nemat;
IEEE-German Microwave conference, Mar. 2011 Vortrag im Rahmen einer Tagung Power divider based on grounded dielectric slab waveguide operating in E 11 x mode 14.03.2011 Darmstadt, Germany, Deutschland Hesselbarth Jan; Dolatsha Nemat;


Abstract

There has been increasing interest on millimeter-wave systems working at frequencies around and above 100 GHz. Communication applications featuring ultra-high data-rates, and security applications using millimeter-wave vision and sensing devices have been described. Despite the unique and useful characteristics of electromagnetic waves at those frequencies, hardware cost reduction remains a tremendous challenge. Here, the interconnection of active and passive devices in a circuit is the most critical task because of the tight requirements on mechanical tolerances. Conventional techniques (namely, wirebonding chips onto planar circuit boards, and connecting boards by connectorized cables) are prohibitively lossy and expensive at frequencies around and above 100 GHz. The project will establish a comprehensive set of techniques to realize compact, high-performance, and cost-efficient systems for this envisaged frequency region. We will make use of low-loss, electromagnetic-bandgap (EBG) confined dielectric waveguide, we will introduce structures for low-loss coupling (by means of radiation, that is, without wirebonds) between active components and waveguides, and we will provide all sorts of passive components including antenna radiators in the EBG-enabled slab waveguide technology. The goal is to establish a set of techniques which will create a new benchmark in terms of low power loss, low cost, and efficient consideration of thermal and weight aspects. The concept is based on modifications of a dielectric slab surface-wave waveguide. Periodic modifications of the dielectric slab (extending in two dimensions) will eventually create an electromagnetic bandgap (EBG) at a certain frequency band, thereby prohibiting the propagation of the surface-wave mode. By disturbing the periodic EBG structure, EBG waveguides and passive functionalities can be created, including bends, couplers, dividers, and antenna radiators. Practically realizable dielectric materials shall be considered, such as plastics or ceramic powder-filled plastics. Investigations will quantify accuracy requirements for the periodic modifications (which are likely to be produced mechanically, e.g., by punching) and for the material properties (considering, e.g., temperature effects). The dielectric slab will be sandwiched between an air half-space on one side, and a metal sheet on the other side. Openings in the dielectric sheet will accommodate active chips, which are then placed on the metal surface. The active chips will couple with the surface-wave waveguide by means of an on-chip dipole antenna structure. The metal sheet is considered to be the top of a (multilayer) circuit board, allowing for lower-frequency (including power supply) signals to be routed inside the multilayer, and eventually to pass them to the active chips on top through openings in the top metal sheet. A good coupling between the signal feeding the on-chip dipole and the surface-wave is crucial. If needed, this coupling can be enhanced by local modifications of the dielectric sheet (such as local metallization of the dielectric sheet), of by modifications of the dipole (such as directors or / and reflectors).
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